晶心科技股份有限公司 Andes Technology Corporation

因應全球外嵌入式系統應用的快速成長,2005年晶心科技創立於新竹科學園區,致力於開發微處理器處理器為核心的系統晶片設計平台(Processor-based SoC Platforms)。晶心科技是一家國際化結合軟硬體平台及系統整合能力且專注於系統晶片核心開發的公司,目前客戶遍及台灣、中國、日韓、歐美之IC設計公司。

隨著電子產業產品日趨多功能化,更多廠商開始對處理器及設計平台要求更佳的整合性、延展性、設計彈性,以及高效能、低成本與低功率。晶心科技以創新的彈性配置平台(Configurable Platforms),搭配獨特的軟硬體智財,來滿足未來客戶對產品高品質及快速上市的需求。

晶心在自有CPU平台架構下經過幾年研發及市場的耕耘,目前的AndesCore™ 家族包括N7、N8、S8、E8、N9、N10、D10和N13系列都已獲客戶採用且量產。此外,晶心科技亦提供適合MCU應用的開發平台AndeShape™ AE210P,可與AndesCore™ N7、N8、S8、E8、N9、N10、D10和N13系列產品進一步結合,非常適合客戶開發物聯網、穿戴式裝置所須的高效能且低功耗的MCU。

AndeShape™ 與AndesCore™系列產品都已成熟到位,可滿足客戶各種應用面的全方位需求。


Gold Sponsor

Secure-IC

Secure-IC is a spin-off from Télécom ParisTech University, one of the most advanced institutes in embedded security research. Sylvain Guilley, Jean-Luc Danger and Laurent Sauvage, Paris Tech researchers and inventors of more than 50 families of patents on embedded security have founded Secure-IC jointly with Hassan Triqui and Philippe Nguyen in January 2010.

Secure-IC is known as a thought leader in physical and cyber security. In order to offer its clients best-of- breed technologies and above state-of- the-art protections, Secure-IC is highly committed in its research community to analyze upcoming threats, explore innovative solutions, and support the work of standardization bodies. Our research activities benefit our partners through trainings or closer collaborations on specific topics.

Going forward, there will be more and more interconnected devices or objects in various market verticals, this is what we call Internet of Things or Internet of Everything. All those objects being interconnected to the cloud, each and every object could be a threat for the whole network. Therefore the security of the objects or the devices is key. Even more, security will become one of the most important assets of the digital world.

Our mission is to partner with our clients throughout and beyond the IC design process to provide best-of- breed security expertise, solutions, and technologies, for embedded systems and connected objects. More than just words, our values define how we conduct ourselves and our business on a day-to- day basis. Our values are vital to the success of Secure-IC and the trust of our clients.

攤位展示主題:
Digital Anti-Tamper Technology

實機展示說明:
With the upcoming Internet of Things, IC design is expected to meet a massive deployment, with more than 20 billion connected devices flooding the world over the next 5 years, in applications such as Smart Cards, Automotive, Smartphones, Set-Top Boxes. Such devices will be used daily and will contain personal and professional information, which means sensitive information that has to be protected. Indeed, every single connected device can be a direct link to the customer’s banking or personal information.

Fault Injection Attacks (FIA) are the most threatening existing attacks against hardware designs nowadays. This attack directly distorts the IC, via an electromagnetic probe, or a heat gun… and is hard to circumvent. The purpose is to use such perturbations in order to fault the computation and observe the generated error on an oscilloscope. This error is afterwards compared to the normal behavior of the system. This procedure allows to recover the secret key. Therefore, it is of paramount importance to implement efficient countermeasures to circumvent these attacks. One state-of- the-art countermeasure is digital detection. This process has the benefit over analog sensors of being free from any input or calibration requirements. An entirely digital IP Core can inform the user in real time of an ongoing fault injection. In that regard, an anti- tamper key technology has been implemented on a FPGA board. This FPGA board is casually running, until a FIA is performed via heat injection. The attack is precisely detected in real-time and an alarm is raised. This alarm is transmitted to a security policy module (for instance, Secure-IC's Secure Monitor).

With a customizable sensitivity, small gate-count and fully digital key technology, Secure-IC enables its customer to detect any fault injection from clock glitches, power underfeeding or laser attacks.


Silver Sponsor (依字母排序)

絡達科技股份有限公司 AIROHA Technology

絡達科技( http://www.airoha.com/ )是國內IC 設計領導廠商, 致力於開發無線通信的高度集成電路,為客戶提供高性能、低成本的各式射頻/混合信號積體電路元件及完整的藍牙/藍牙低功耗系統單晶片解決方案。產品主要包括手機功率放大器(PA)、射頻開關(T/R Switch)、低雜訊功率放大器(LNA)、數位電視與機頂盒衛星(DVB-S/S2)調諧器,WiFi射頻收發器和藍牙系統單晶片。
目前絡達的產品已廣泛使用在各式手機、數位電視與機頂盒、藍牙輸入控制、音訊周邊設備及穿戴式產品。


知億科技股份有限公司Dorado Design Automation,Inc.

ECO (Engineering Change Order) is Dorado's corporate commitment to the semiconductor industry.

Dorado’s Tweaker ECO tool suite supports all possible incremental jobs such as Timing ECO, Metal ECO, Power ECO, Clock ECO, and Functional ECO.

​On top of that, the next generation of ECO solutions that consists of the Hierarchical ECO Flow, Advanced ECO Flow, CPU Flow, and Low Power Flow are provided for addressing the increasing ECO challenges of advanced chips.

At the moment that ECO becomes a very critical part of design flow. Tweaker's state-of-the-art ECO flows are in use by various types of leading semiconductor companies including IDM’s, foundries, and fabless companies worldwide.

For more information, please visit http://www.dorado-da.com

攤位展示主題:
The Next Generation of ECO Solutions

實機展示說明:
不同特性的晶片在ECO階段有不同的需求,例如超大型的​晶片需要的是快速的Timing Closure,而CPU core則是注重在晶片的功耗與速度的平衡。
Dorado 將展示最新開發的下一代ECO Solutions,分享如何針對特定的狀況,使用不同的ECO Flow來達成目標。


力旺電子 eMemory Technology Inc.

力旺電子為全球最大的嵌入式非揮發性記憶體(eNVM)技術開發及矽智財供應廠商。力旺電子與全球主要的晶圓代工廠、整合元件製造商以及專業IC設計公司有緊密的合作關係,協助這些合作夥伴導入力旺電子獨特開發之矽智財(IP)。

NeoFuse, NeoBit, NeoEE, NeoMTP 與 NeoFlash 為力旺電子之五大核心技術,目前全球已有超過150億個IC產品,嵌入使用力旺電子所提供的核心技術,應用領域涵括消費性電子產品、工業規格、以及車用電子之領域。

力旺電子獨特開發之矽智財及技術平台,對於每一個合作夥伴而言,均扮演著重要的角色。對於專業IC設計公司,技術平台的普及提供了供應商的選擇彈性以及製程的可攜性;對整合元件製造商,此技術平台將可帶來製程微縮以及極具產業價值之know-how;對晶圓代工廠,此技術平台更代表著開發全球龐大的潛在客戶資源。

攤位展示主題:
嵌入式非揮發記憶體矽智財服務與解決方案 


實機展示說明:
力旺電子致力於滿足業界對於嵌入式記憶體技術之需求,並提供晶圓代工廠、整合元件製造商以及專業IC設計公司最佳解決方案。多年來,力旺電子在設計、製造以及工程技術方面,已累積深厚的經驗與實力,同時發展出完整的嵌入式非揮發性記憶體矽智財製程平台,提供相關的技術、產品以及解決方案。
除了提供先進且完整之矽智財及技術平台,力旺電子更建立一套高度整合的服務模式,自先期的設計階段到投片量產,力旺電子均提供DSS(DSS,Design Service Solution)之全方位服務。此DSS設計服務解決方案,係目前業界最完整之矽智財管理與服務系統,可提供客戶百分百的服務與承諾。


法商穎設科技有限公司 InsideSecure

法商穎設科技( http://www.insidesecure.com )是一家總部位於法國專注於安全解決方案的上市公司. 其產品線涵蓋兩大範疇: 其一為行動App安全保護工具及DRM內容保護與HCE移動支付軟體套件,其二為嵌入式安全解決方案,本公司不僅提供不同通信協議層的通信安全解決方案,在硬件HWIP方面,針對廣大物聯網相關應用過程中之身分驗證,與數據加密提供適合該應用場景的彈性方案,應用範圍包含SSD控制器嵌入式安全IP,影像接口如HDMI,DisplayPort上所需之HDCP2.2, DTCP-IP,有針對便攜式產品中Flash/SD進行資料加密之DAR, 針對安全通訊之 MacSec, IPSec, SSL/DTLS, 其中之加密模塊(Crypto Module)與算法(Cipher)更是經過FIPS 認證,數據中心超高速網通晶片封包安全引擎相關解決方案更居業界領導地位.同時於本地亦有原廠技術支持提供無縫查詢。

攤位展示主題:
Security in Everywhere

實機展示說明:
法商穎設科技( http://www.insidesecure.com )是一家總部位於法國專注於安全解決方案的上市公司. 其產品線涵蓋兩大範疇: 其一為行動App安全保護工具及DRM內容保護與HCE移動支付軟體套件,其二為嵌入式安全解決方案,本公司不僅提供不同通信協議層的通信安全解決方案,在硬件HWIP方面,針對廣大物聯網相關應用過程中之身分驗證,與數據加密提供適合該應用場景的彈性方案,應用範圍包含SSD控制器嵌入式安全IP,影像接口如HDMI,DisplayPort上所需之HDCP2.2, DTCP-IP,有針對便攜式產品中Flash/SD進行資料加密之DAR, 針對安全通訊之 MacSec, IPSec, SSL/DTLS, 其中之加密模塊(Crypto Module)與算法(Cipher)更是經過FIPS 認證,數據中心超高速網通晶片封包安全引擎相關解決方案更居業界領導地位.同時於本地亦有原廠技術支持提供無縫技術服務.


巨有科技股份有限公司 Progate Group Corporation

巨有科技創立於1991年,在IC設計服務產業擁有25年的經驗,總部設立於台北市內湖科技園區。從一開始,巨有科技就致力於SOC/ASIC設計的Turnkey服務,是台灣第一家ASIC設計服務的提供者,為台積電(TSMC)第一位的ASIC策略夥伴、IC設計服務策略聯盟 (Design Center Alliance;DCA/VCA)。 巨有科技自建無塵室測試工廠(Class1000),擁有Chroma 3650 與Credence D-10提供完整的測試設備(C/P、F/T、FA…等),從測試程式開發、工程驗證到大量測試皆可完全涵蓋,測試產能:C/P每月可達8000片晶圓片、F/T每月可達8百萬顆。巨有科技與許多國內外IP公司建立長期穩定的合作的關係,累積許多IP使用、整合、驗證的技術經驗,也可以為客戶訂做各種IP,且在研發技術上更不斷地追求突破與創新ASIC→SOC→Platform ASIC,於2008年已具備90奈米半導體製程的技術,並支援設計完成數個IC的專案,在2010年有數個 Platform ASIC design in且 Tape out 了好幾個65奈米的專案,於2011年的第二季開始,巨有科技更進一步提供40 奈米的IC設計服務,並於2014年~2015年完成數個40奈米和28奈米的專案。如需詳盡資料,請瀏覽巨有科技網站: http://www.pgc.com.tw查詢。

攤位展示主題:
IC Design Service and Turnkey


實機展示說明:
SOC/ASIC Turnkey Service
PSOC Implementation Platform Service
MPW (Multi-Project Wafer) Shuttle Bus Service
Gate Array Turnkey Service
Platform ASIC Turnky Service
IP Design Service
MLM (Multi-Layer Mask) Turnkey Service
APR Design Service
COT(GDSII TO CHIP) Turnkey Service
SiP (System-in- Package) Turnkey Service
SOC/ASIC Product Turnkey Service (PGC+TSMC+ASE)


華邦電子股份有限公司 Winbond Electronics Corporation

Winbond is a specialty memory IC company engaged in design, manufacturing and sales services. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele top quality memory solutions. Winbond's major product lines include Code Storage Flash Memory, Specialty DRAM, Mobile DRAM, and TrustME Secure Flash Memory.

Winbond introduces the pioneering TrustME Secure Flash Memory that has been Common Criteria EAL 5+ certified for applications in enhanced system security.

攤位展示主題:

實機展示說明:
The world's 1st tamper and SCA/DPA resistant secure flash device Common Criteria EAL5+ certified in Spain (SOGIS) Provide root of trust and secure boot Tamper-resistant storage of critical user’s data and platform credentials Secure remote provisioning and Secure remote firmware updates Tracking device metadata With Winbond Secure Flash Interface (SFI) IP, scalable secure flash densities for different SOC demands can be covered by TrustME, such as payment, biometrics, automotive, IOT. Flexible standalone or SiP architecture which enables the optimization of system performance and cost.


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